Automotive Linux Summit & Open Source Summit Japan 2018

To support AGL distribution for various boards, SoC architecture, there is a big concern about how to distribute the HW-dependent packages efficiently. Nowadays, in order to update the HW vendor's dependent packages, a full Yocto build are likely carried out. It requires much skill of developers, need deep Yocto knowledge to replace the packages and solve the local environment issues. Moreover, it might take much CPU time to finish a full Yocto build for AGL distribution which incrementally becomes bigger year by year. Following the introduction of a binary packaging distribution solution from IoT.BZH member, Khiem would like to expand the solution to support hardware-dependent package delivery. The purpose is to utilize the available common solution as well as to reduce effort of updating AGL distribution images and AGL Software Development Kit (SDK).